Metal Pad for Laser Marking

ABSTRACT

A package includes a device die, a molding material molding the device die therein, and a plurality of redistribution lines overlying the device die and the molding material. A laser mark pad is coplanar with one of the plurality of redistribution lines, wherein the laser mark pad and the one of the plurality of redistribution layers are formed of the same conductive material. A polymer layer is over the laser mark pad and the plurality of redistribution lines. A tape is attached over the polymer layer. A laser mark penetrates through the tape and the polymer layer. The laser mark extends to a top surface of the laser mark pad.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a divisional of U.S. application Ser. No.14/486,353, filed Sep. 15, 2014, and entitled “Metal Pad for LaserMaking”, which application claims the benefit of the followingprovisionally filed U.S. Patent application: Application Ser. No.62/005,692, filed May 30, 2014, and entitled “Metal pad for LaserMarking,” and is related to U.S. patent application Ser. No. 14/192,341,filed on Feb. 27, 2014, entitled “Laser Marking in Packages,” whichapplications are hereby incorporated herein by reference.

BACKGROUND

In the packaging of integrated circuits, there are various types ofpackaging methods and structures. For example, in a conventionalPackage-on-Package (POP) process, a top package is bonded to a bottompackage. The top package and the bottom package may also have devicedies packaged therein. By adopting the PoP process, the integrationlevel of the packages is increased.

In an existing PoP process, the bottom package is formed first, whichincludes a device die bonded to a package substrate. A molding compoundis molded on the package substrate, wherein the device die is molded inthe molding compound. The package substrate further includes solderballs formed thereon, wherein the solder balls and the device die are ona same side of the package substrate. The solder balls are used forconnecting the top package to the bottom package.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1 through 7 illustrate the cross-sectional views of intermediatestages in the formation of a package in accordance with someembodiments;

FIG. 8 illustrates the top view of a package in accordance with someembodiments, wherein a plurality of laser mark pads is isolated fromeach other;

FIG. 9 illustrates the top view of a package in accordance with someembodiments, wherein a laser mark pad is connected to a through-via;

FIG. 10 illustrates the top view of a package in accordance with someembodiments, wherein a laser mark and a respective laser mark pad aremisaligned with a device die in the package;

FIG. 11 illustrates the top view of a package in accordance with someembodiments, wherein a plurality of laser marks is formed over a largelaser mark pad; and

FIG. 12 illustrates the top view of a package in accordance with someembodiments, wherein a large laser mark pad includes a plurality ofslots.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “underlying,” “below,”“lower,” “overlying,” “upper” and the like, may be used herein for easeof description to describe one element or feature's relationship toanother element(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

A package and the method of forming laser marks in the package areprovided in accordance with various exemplary embodiments. Thevariations of the embodiments are discussed. Throughout the variousviews and illustrative embodiments, like reference numbers are used todesignate like elements.

FIG. 1 illustrates a cross-sectional view of package 100. In accordancewith some embodiments of the present disclosure, package 100 includesdevice die 102, with the front side of device die 102 facing down andbonded to Redistribution Lines (RDLs) 112. In alternative embodiments,package 100 includes more than one device die. Device die 102 mayinclude semiconductor substrate 108 and integrated circuit devices 104(such as active devices, which may include Metal Oxide Semiconductor(MOS) transistors or diodes, for example) on the front surface (thesurface facing down) of semiconductor substrate 108. Device die 102 maybe a logic die such as a Central Processing Unit (CPU) die, a GraphicProcessing Unit (GPU) die, a mobile application die, or the like.Throughout the description of the present disclosure, the side of devicedie 102 facing down in FIG. 1 is referred to as the front side of devicedie 102, and the side of device die 102 facing up in FIG. 1 is referredto as the backside of device die 102. The back surface 108A ofsemiconductor substrate 108 is also the back surface of device die 102.

Device die 102 is molded in molding material 120, which encircles devicedie 102. Molding material 120 may be a molding compound, a moldingunderfill, a resin, or the like. The bottom surface 120A of moldingmaterial 120 may be level with the bottom end of device die 102. The topsurface 120B of molding material 120 may be level with or higher thanback surface 108A of semiconductor substrate 108. In accordance withsome embodiments of the present disclosure, back surface 108A ofsemiconductor substrate 108 is overlapped by, and in contact with,die-attach film 110, which is a dielectric film adhering device die 102to the overlying dielectric layer 118. Device die 102 further includesmetal pillars/pads 106 (which may include copper pillars, for example)in contact with, and bonded to, RDLs 112. Metal pillars 106 may beembedded in a surface dielectric layer (not marked) of device die 102.

Package 100 includes RDLs 112 underlying device die 102 and RDLs 116overlying device dies 102. RDLs 112 are also referred to as front-sideRDLs since they are on the front side of device die 102. RDLs 116 arealso referred to as backside RDLs since they are on the backside ofdevice die 102. Front-side RDLs 112 are formed in one or a plurality ofdielectric layers 114, and backside RDLs 116 are formed in one or aplurality of dielectric layers 118. Although FIG. 1 illustrates thatthere is one layer of backside RDLs 116 and a plurality of layers offront-side RDLs 112, it is appreciated that the numbers of layersconstructing RDLs 112 and 116 are determined by routing requirements andmay be different from what is illustrated. RDLs 112 and 116 may beformed of copper, aluminum, nickel, titanium, tantalum, alloys thereof,and/or multi-layers thereof.

In accordance with some embodiments of the present disclosure,dielectric layers 114 and 118 are formed of organic materials such aspolymers, which may further include polybenzoxazole (PBO),benzocyclobutene (BCB), polyimide, solder mask, or the like. Inalternative embodiments, dielectric layers 114 and 118 are formed ofinorganic material such as silicon oxide, silicon nitride, siliconoxynitride, or the like. Furthermore, some of dielectric layers 114 and118 may be a composite layer including a plurality of sub-layers formedof different materials. For example, one exemplary dielectric layer 114or 118 may include a silicon oxide layer and a silicon nitride layer.

In accordance with some embodiments of the present disclosure, theformation of each layer of RDLs 116 and dielectric layers 118 includesthe forming of a blanket seed layer (not shown) using Physical VaporDeposition (PVD), the forming and patterning of a photo resist (notshown) to cover some portions of the blanket seed layer, the plating ofthe RDLs in the openings in the photo resist, and then the removal ofthe photo resist and etching of the portions of the seed layerpreviously covered by the removed photo resist.

Through-vias 122 are formed to penetrate through molding material 120.In accordance with some embodiments of the present disclosure,through-vias 122 have top surfaces level with the top surface 120B ofmolding material 120 and bottom surfaces level with the bottom surface120A of molding material 120. Through-vias 122 electrically connectfront-side RDLs 112 to backside RDLs 116. Through-vias 122 may also bein physical contact with front-side RDLs 112 and backside RDLs 116.Through-vias 122 may be formed by forming a patterned mask (not shown)with openings therein and plating through-vias 122 in the openings inthe patterned mask. Through-vias 122 may comprise copper, aluminum,titanium, nickel, palladium, or alloys thereof.

Through-vias 122 may be formed close to the periphery of package 100, asshown in FIGS. 8 through 12, although through-vias 122 may also beformed in any other locations of package 100. Through-vias 122 may bealigned to a ring that encircles laser mark pad 128 in accordance withsome embodiments of the present disclosure.

Electrical connectors 124, which are formed of non-solder metallicmaterials, are formed at the bottom surface of package 100. Inaccordance with some embodiments of the present disclosure, electricalconnectors 124 include Under-Bump Metallurgies (UBMs) or metal pads. Inalternative embodiments, electrical connectors 124 include metal pillarssuch as copper pillars. Throughout the description, electricalconnectors 124 are metal pads 124, although they may have other forms.Metal pads 124 may comprise copper, aluminum, titanium, nickel,palladium, gold, or multi-layers thereof. In accordance with someembodiments of the present disclosure, as shown in FIG. 1, the bottomsurfaces of metal pads 124 protrude beyond the bottom surface of thebottom dielectric layer 114. In alternative embodiments, the bottomsurfaces of metal pads 124 are coplanar with the bottom surface of thebottom dielectric layer 114. Solder regions 126 may be attached to thebottom surfaces of metal pads 124.

On the backside of device die 102, conductive features such as RDLs 116(including metal traces, metal pads, and metal vias) are formed. Inaccordance with some embodiments of the present disclosure, there is aplurality of layers of RDLs 116 interconnected through a plurality ofvias. In accordance with alternative embodiments, there is a singlelayer of RDLs 116.

Further referring to FIG. 1, metal pad 128 is formed. Metal pad 128 isreferred to as laser mark pad hereinafter since it is used for forminglaser marks. In accordance with some embodiments of the presentdisclosure, laser mark pad 128 is formed in the top layer of RDLs 116.In accordance with alternative embodiments, laser mark pad 128 is formedin an RDL layer other than the top layer. Laser mark pad 128 may beelectrically floating. Alternatively, laser mark pad 128 is electricallyconnected to other conductive features such as RDLs 116 and/orthrough-vias 122 through metal trace 144, which is a part of RDLs 116.For example, laser mark pad 128 may be connected to the electricalground. Laser mark pad 128 is formed simultaneously with RDLs 116 in thesame metal layer.

In some exemplary embodiments, seal ring 130 is formed to encircle lasermark pad 128, wherein the exemplary seal ring 130 may be found in FIG.8. As shown in FIG. 1, seal ring 130 is formed in the same metal layeras laser mark pad 128. In accordance with some embodiments of thepresent disclosure, seal ring 130 is formed in a single layer of RDLs116. In alternative embodiments, seal ring 30 extends into a pluralityof layers of RDLs 116. Seal ring 130 may be electrically floating andmay be fully enclosed by dielectric materials. In alternativeembodiments, seal ring 130 is electrically coupled to other conductivefeatures such as RDLs 116 and/or through-vias 122. Seal ring 130 may beformed simultaneously when laser mark pad 128 is formed. Accordingly,seal ring 130, RDLs 116, and laser mark pad 128 may be formed of thesame material and have the same composition. Alternatively, no seal ringis formed to encircle laser mark pad 128.

In accordance with some embodiments, the bottom surfaces of laser markpad 128 and seal ring 130 are higher than the top surface of die-attachfilm 110 and the top surface 120B of molding material 120. One ofdielectric layers 118 (marked as 118A in FIG. 1) is formed underneathlaser mark pad 128 and seal ring 130, with the top surface of therespective dielectric layer 118A contacting the bottom surfaces of lasermark pad 128. The bottom surface of dielectric layer 118A may be incontact with the top surface of die attach film 110 and the top surfaceof molding material 120.

As also shown in FIG. 1, dielectric layer 131 is formed. The bottom ofdielectric layer 131 is in contact with the top surface of dielectriclayer 118. Furthermore, the bottom surface of dielectric layer 131 isalso in contact with the top surfaces of RDLs 116 and laser mark pad128. In accordance with some exemplary embodiments of the presentdisclosure, dielectric layer 131 is formed of a polymer, and hence isreferred to as polymer layer 131 throughout the description. It isappreciated that dielectric layer 131 may also be formed of anon-polymer material. The exemplary candidate materials for formingpolymer layer 131 include, but are not limited to, PBO, BCB, polyimide,and the like.

Referring to FIG. 2, tape 133 is laminated onto polymer layer 131 andmay be adhered to polymer layer 131 through heat curing. Tape 133 mayprovide protection and reinforcement to the underlying packagestructure. Tape 133 also blocks light from penetrating into theunderlying package structure, reducing its adverse effects. Tape 133also helps reduce chipping during the subsequent dicing process of thepackage. In accordance with some embodiments, tape 133 and polymer layer131 may be formed of different materials.

Referring to FIG. 3, a laser marking is performed to form laser marks132 in tape 133 and dielectric layer 131, wherein laser marks 132include the trenches formed in tape 133 and dielectric layer 131. Thelaser marking is performed using laser beam 134, which burns and removesparts of tape 133 and dielectric layer 131. In accordance with someembodiments of the present disclosure, the burned parts of tape 133 anddielectric layer 131 overlap laser mark pad 128. Laser mark pad 128 actsas a protection layer, wherein laser beam 134 is not able to penetratethrough laser mark pad 128 to damage the layers and devices underneathlaser mark pad 128. Hence, laser mark pad 128 has the function ofpreventing laser beam 134 from reaching the underlying device die 102and the underlying RDLs 116, if any.

Laser marks 132 may include letters, digits, figures, or any othersymbols that can be used for identification purpose. For example, FIG. 8illustrates some exemplary laser marks 134 that include letters anddigits. Laser marks 132 may be used to identify the product, themanufacturing sequence, the lot number of the respective package, or anyother information that is used to track the respective package. Afterthe laser marking, some portions of laser mark pad 128 are exposedthrough the trenches that form laser marks 132.

FIG. 4 illustrates the removal of some parts of tape 133 and dielectriclayer 131 to expose metal pads 116′, which may be parts of RDLs 116. Asa result, openings 136 are formed in dielectric layer 131 and tape 133.In accordance with some exemplary embodiments, the formation of openings136 is achieved through burning tape 133 and dielectric layers 118 usinga laser beam. In accordance with alternative embodiments, openings 136are formed through a photolithography process, in which tape 133 anddielectric layer 131 are etched. In the resulting structure, the bottomsurfaces of openings 136 and laser marks 132 may be substantiallycoplanar, that is, at the same level as the top surfaces of laser markpad 128 and RDL pads 116′.

FIG. 5 illustrates the formation of solder regions 138. In accordancewith some embodiments of the present disclosure, a ball placement stepis performed to drop solder balls in openings 136 (FIG. 3), followed bya reflow process to reflow the solder balls to form solder regions 138.Solder regions 138 include portions contacting the top surfaces of RDLpads 116′and may also include some portions outside of openings 136. Inalternative embodiments, the solder region formation step is skipped.Rather, the solder used for forming solder regions 138′ (FIG. 6) isprovided by the solder regions attached to package component 200, asshown in FIG. 6.

FIG. 6 illustrates the bonding of package 200 with package 100. Inaccordance with some embodiments of the present disclosure, package 200includes package substrate 202 and device die(s) 204, which are bondedto package substrate 202. The bonding of device dies 204 to packagesubstrate 202 may be achieved through wire bonding, flip-chip bonding,or the like. In accordance with some exemplary embodiments, device dies204 include memory dies such as Static Random Access Memory (SRAM) dies,Dynamic Random Access Memory (DRAM) dies, or the like.

In the bonding process, the solder regions 138 as shown in FIG. 5 arereflowed to form solder regions 138′ as in FIG. 6. After the bondingprocess, there is a gap between package 200 and package 100, and lasermarks 132 are exposed to the gap.

Referring to FIG. 7, in accordance with some embodiments of the presentdisclosure, after the bonding of package 200, underfill 140 is filledinto the gap between package 100 and package 200. In these embodiments,the trenches of laser mark 132 (FIG. 4) are also filled with underfill140. Accordingly, the portions of underfill 140 in the trenches of thelaser mark 132 are alternatively referred to as laser marks 132′. Lasermarks 132′ may extend from the top surface of tape 133 to the topsurface of laser mark pad 128. Furthermore, laser marks 132′ may be inphysical contact with the top surface of laser mark pad 128. Inalternative embodiments, no underfill is filled into the gap betweenpackages 100 and 200, and hence in the final package (for example, atthe time the package is used and powered on), laser marks 132 remaintrenches (refer to FIG. 6). In these embodiments, some portions of lasermark pad 128 may be exposed to air through laser marks 132.

In the package as shown in FIG. 7, laser mark pad 128 may be fullyenclosed by, and in contact with, dielectric materials includingdielectric layers 118 and 131 as well as underfill 140.

FIG. 8 illustrates a top view of package 100 in accordance with someembodiments. As shown in FIG. 8, laser marks 132 may overlap laser markpad 128, wherein all laser marks 132 are formed on laser mark pad 128.Seal ring 130 is formed in accordance with some embodiments of thepresent disclosure and forms a ring encircling laser mark pad 128. Insome exemplary embodiments, there is a plurality of discrete laser markpads 128 that are physically separated from each other. The discretelaser mark pads 128 may also be electrically isolated from each other inaccordance with some embodiments. The sizes of laser mark pads 128 maybe selected depending on the size of package 100 and the desirable sizesof laser marks 132. For example, the length “a” and width “b” of lasermark pads may be in the range of about 1 mm to about 5 mm, and thespacing “S” between neighboring laser mark pads 128 may be greater thanabout 500 μm. It is appreciated, however, that the values recitedthroughout the description are merely examples and may be changed todifferent values.

In accordance with some exemplary embodiments, as shown in FIGS. 7 and 8in combination, each part of discrete laser mark pads 128 is fullyenclosed in dielectric materials, with no surface of the discrete lasermark pads 128 in contact with conductive materials in these exemplaryembodiments. For example, the bottom surface and the sidewall surfacesof the discrete laser mark pads 128 are in contact with dielectriclayers 118, as shown in FIG. 7. The top surfaces of discrete laser markpads 128 are in contact with polymer layer 131. Furthermore, someportions of the top surfaces of discrete laser mark pads 128 are incontact with underfill 140 as in the embodiment in FIG. 7, or air as inthe embodiment in FIG. 6.

During the laser marking, heat is generated and results in thedielectric layers around laser mark pads 128 being undesirably burned,causing the deformation of dielectric layers 118 and RDLs 116 as well asother reliability problems. Accordingly, it is desirable to quicklydissipate the heat generated in laser mark pads 128 to other regions andfeatures so that the temperature of laser mark pads 128 is limited underthe burning/deforming temperature of layers 118, 131, and 133. Seal ring130 may dissipate heat in some embodiments. To improve the efficiency inheat dissipation, seal ring 130 may have a greater width W1 that is, forexample, greater than about 20 μm to provide low thermal resistance sothat an overheated portion of seal ring 130 may quickly dissipate theheat to other portions of seal ring 130. In alternative embodiments, noseal ring 130 is formed.

Furthermore, in order to improve the heat-dissipating efficiency, someor all of laser mark pads 128 are interconnected through metal traces142, as in the embodiments shown in FIG. 9. Accordingly, when lasermarking is performed to form laser mark(s) 132 over one of laser markpads 128, the heat may be dissipated to neighboring laser mark pads 128.In accordance with some exemplary embodiments, width W2 of metal traces142 is greater than about 20 μm or about 100 μm or more to providebetter heat dissipation. Width W2 is further smaller than width b oflaser mark pads 128.

In addition to metal traces 142, additional metal traces 144 may beformed to further dissipate heat to nearby features. For example, asshown in FIG. 9, metal traces 144 connect metal pads 128 to some ofthrough-vias 122 (marked as 122A) so that during the laser markingprocess, through-vias 122A act as heat sinks to help reduce thetemperature of laser mark pads 128. The exemplary metal traces 144 mayalso be found in FIG. 7, which shows that one of laser mark pads 128 isconnected to through-via 122A. In accordance with some embodiments,through-via 122A is connected to electrical ground. In alternativeembodiments, through-via 122A is a signal via that is used to carryslow-changing signals (with a low frequency that is, for example, lowerthan about 1 MHz or 1 kHz).

In FIGS. 8 and 9, laser mark pads 128 and laser marks 132 are formeddirectly over, and overlap, device die 102. In alternative embodiments,as shown in FIG. 10, which also illustrates a top view of package 100,laser mark pads 128 and laser marks 132 are not aligned to device die102. In these embodiments, the heat dissipated from laser mark pads 128is less likely to adversely affect device die 102 due to the increaseddistance between laser mark pads 128 and device die 102.

FIGS. 11 and 12 illustrate the top views of packages 100 in accordancewith additional embodiments, wherein laser mark pad 128 is a large lasermark pad that occupies a significant area of package 100, wherein alaser mark pad 128 may have a plurality of laser marks 32 formedthereon. As shown in FIG. 11, the large laser mark pad 128 may be asolid metal pad in these embodiments. In the embodiments as shown inFIG. 12, there is again a single laser mark pad 128, with a plurality ofslots 146 formed in laser mark pad 128. Slots 146 penetrate throughlaser mark pad 128. The plurality of slots 146 help reduce the stress inpackage 100, wherein the stress is generated due to the differencebetween the Coefficients of Thermal Expansion (CTEs) of laser mark pad128 and the surrounding dielectric materials 118, 131, and 140. Theembodiments in FIGS. 11 and 12 have the advantageous feature of goodthermal dissipation in the laser marking due to the large area of lasermark pad 128.

The area of laser mark pad 128 and slots 146 may be adjusted so that themetal density in the metal layer of laser mark pad 128 is not overlyhigh. The metal density is the ratio of the total area of all metalfeatures (including RDLs 116 and laser mark pads 128) divided by thearea of package 100. In some exemplary embodiments, the metal density iscontrolled to be lower than about 50 percent.

The embodiments of the present disclosure have several advantageousfeatures. By forming the laser mark pads, the depth of the laser markingis controlled by the laser mark pads. The device dies and theredistribution lines in the packages are protected from the likelydamage caused by the laser marking. The embodiments of the presentdisclosure do not incur additional manufacturing costs since the lasermar pads may be formed at the same time the redistribution lines of thepackage are formed.

In accordance with some embodiments of the present disclosure, a packageincludes a device die, a molding material molding the device dietherein, and a plurality of redistribution lines overlying the devicedie and the molding material. A laser mark pad is coplanar with one ofthe plurality of redistribution lines, wherein the laser mark pad andthe one of the plurality of redistribution layers are formed of the sameconductive material. A tape is attached over the polymer layer. A lasermark penetrates through the tape and the polymer layer. The laser markextends to a top surface of the laser mark pad.

In accordance with alternative embodiments of the present disclosure, apackage includes a first package including at least one first dielectriclayer, a first plurality of redistribution lines in the at least onefirst dielectric layer, a device die over and electrically coupled tothe first plurality of redistribution lines, a molding material moldingthe device die therein, a through-via penetrating through the moldingmaterial, at least one second dielectric layer over the device die, anda second plurality of redistribution lines in the at least one seconddielectric layer. One of the second plurality of redistribution lines iselectrically coupled to one of the first plurality of redistributionlines through the through-via. The package further includes a metal padis in the at least one second dielectric layer, wherein the metal pad isconnected to the through-via, a third dielectric layer overlying the atleast one second dielectric layer, a laser mark extending from a topsurface of the third dielectric layer to a top surface of the metal pad,and a second package over and bonded to the first package.

In accordance with yet alternative embodiments of the presentdisclosure, a method includes forming a package, which includes at leastone first dielectric layer, a first plurality of redistribution lines inthe at least one first dielectric layer, a device die over andelectrically coupled to the first plurality of redistribution lines, amolding material molding the device die therein, a through-viapenetrating through the molding material, at least one second dielectriclayer over the device die, a second plurality of redistribution lines inthe at least one second dielectric layer, wherein the second pluralityof redistribution lines is electrically coupled to the first pluralityof redistribution lines through the through-via, and a metal pad in theat least one second dielectric layer. A polymer layer is formedoverlying the at least one second dielectric layer, a tape is attachedover the polymer layer. The method further includes performing a lasermarking to form a laser mark in the polymer layer and the tape, withportions of the metal pad exposed to the laser mark.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming a first packagecomprising: at least one first dielectric layer; a first plurality ofredistribution lines in the at least one first dielectric layer; adevice die over and electrically coupled to the first plurality ofredistribution lines; an encapsulating material encapsulating the devicedie; a through-via penetrating through the encapsulating material; atleast one second dielectric layer over the device die; a secondplurality of redistribution lines in the at least one second dielectriclayer, wherein one of the second plurality of redistribution lines iselectrically coupled to one of the first plurality of redistributionlines through the through-via; and a metal pad in the at least onesecond dielectric layer; forming a polymer layer overlying the at leastone second dielectric layer; attaching a tape over the polymer layer;and performing a laser marking to form a laser mark in the polymer layerand the tape, with portions of the metal pad exposed to the laser mark.2. The method of claim 1, wherein the laser mark comprises a letter or adigit.
 3. The method of claim 1 further comprising: forming openings inthe polymer layer and the tape to expose a plurality of metal pads; andforming solder regions extending into the openings to join to theplurality of metal pads.
 4. The method of claim 1 further comprisingbonding a second package to the first package, wherein the secondpackage overlaps the laser mark.
 5. The method of claim 4 furthercomprising filling an underfill into a gap between the first package andthe second package, wherein the underfill is disposed into the lasermark.
 6. The method of claim 5, wherein the underfill physicallycontacts the metal pad.
 7. The method of claim 1, wherein the metal padstops a laser beam used in the laser marking.
 8. The method of claim 1,wherein the metal pad is electrically connected to the through-via.
 9. Amethod comprising: forming a first package comprising: a device die; anencapsulating material encapsulating the device die; a first dielectriclayer over the device die and the encapsulating material; a firstredistribution line and a metal pad over the first dielectric layer; anda second dielectric layer over the first redistribution line and themetal pad; attaching a tape over the second dielectric layer; and usinga laser beam to form a laser mark penetrating through the seconddielectric layer and the tape, wherein the laser beam stops on the metalpad, and the laser mark has a pattern of a letter or a digit.
 10. Themethod of claim 9 further comprising attaching the device die to thefirst dielectric layer through a die-attach film, wherein metal padoverlaps the die-attach film.
 11. The method of claim 9, wherein theencapsulating material further encapsulates a first metal post, and thefirst redistribution line connects the metal pad to the first metalpost.
 12. The method of claim 11, wherein the encapsulating materialfurther encapsulates a second metal post, and the metal pad is connectedto the second metal post through an additional metal pad over the firstdielectric layer.
 13. The method of claim 12 further comprising: forminga plurality of metal pads electrically connected through a plurality ofredistribution lines, wherein the plurality of metal pads iselectrically connected in series; and forming an additional laser markover each of the plurality of metal pads.
 14. The method of claim 9further comprising: bonding a second package to the first package; andfilling an underfill into a gap between the first package and the secondpackage, wherein the underfill is disposed into the laser mark.
 15. Amethod comprising: forming a first package comprising: encapsulating adevice die and a first metal post in an encapsulating material; forminga first dielectric layer over the device die and the encapsulatingmaterial; forming a plurality of redistribution lines over the firstdielectric layer, wherein portions of the plurality of redistributionlines are electrically coupled to the device die; forming a metal padover the first dielectric layer, wherein the metal pad is electricallycoupled to the first metal post; and disposing a second dielectric layerover the plurality of redistribution lines and the metal pad; using alaser beam to form a laser mark as an opening penetrating through thesecond dielectric layer, wherein the laser beam stops on the metal pad,and the laser mark has a pattern of a letter or a digit; and filling theopening with a dielectric material.
 16. The method of claim 15, whereinthe filling the opening with the dielectric material comprises fillingan underfill.
 17. The method of claim 16 further comprising bonding asecond package to the first package, wherein the underfill is filledinto a gap between the first package and the second package.
 18. Themethod of claim 15 further comprising encapsulating a second metal postin the encapsulating material, wherein the metal pad is electricallyconnected to both the first metal post and the second metal post byredistribution lines.
 19. The method of claim 18, wherein the metal padis coupled between the first metal post and the second metal post. 20.The method of claim 15 further comprising electrically grounding themetal pad and the first metal post.